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Description
- comprehensive portfolio for the electronics and semiconductor industry
- for scientists engaged in education, research, development, prototyping and small scale fabrication of high tech micro- and nanochips
- Superior purity, stability and exceptional lot-to-lot consistency
- includes high purity products required for high performance applications such as etchants, solvents or hexamethyldisilazane (HMDS)
Specifications
Specifications
| CAS | 7722-84-1, 7732-18-5 |
| Boiling Point | Decomposes on heating. |
| CAS Min % | 68.90%, 30.00% |
| CAS Max % | 69.90%, 31.00% |
| Molecular Formula | H2O2 |
| InChI Key | MHAJPDPJQMAIIY-UHFFFAOYSA-N |
| SMILES | OO |
| IUPAC Name | peroxol |
| Molecular Weight (g/mol) | 34.01 |
| PubChem CID | 784 |
| Show More |
Safety and Handling
Product Identifier
- Hydrogen peroxide
- Danger
- Acute toxicity Category 4
- Serious eye damage/eye irritation Category 1
- H302-Harmful if swallowed.
- H318-Causes serious eye damage.
- P260-Do not breathe dust/fume/gas/mist/vapours/spray.
- P280-Wear protective gloves/protective clothing/eye protection/face protection.
- P301+P330+P331-IF SWALLOWED: rinse mouth. Do NOT induce vomiting.
- P305+P351+P338-IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
- P308+P313-IF exposed or concerned: Get medical advice/attention.
- MIXTURE LIST-Contain: hydrogen peroxide solution
Product Title
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